SMT Capacity

SMT Assembly Capacity: High-end Manufacturing Equipment, Excellent Production Efficiency, Steamline Product Appearance.
ItemCapability
Single and double sided SMT/PTH Yes
Large parts on both sides, BGA on both sides Yes
Smallest Chips size 0201
Min BGA and Micro BGA pitch and ball counts 0.008 in. (0.2mm) pitch, ball count greater than 1000
Min Leaded parts pitch 0.008 in. (0.2 mm)
Max Parts size assembly by machine 2.2 in. x 2.2 in. x 0.6 in.
Assembly surface mount connectors Yes Min PCB Thickness 0.02
Odd form parts: LED Resistor and capacitor networks Electrolytic capacitors Variable resistors and capacitors (pots) Sockets Yes
Wave soldering Yes
Max PCB size 14.5 in. x 19.5 in.
Assembly surface mount connectors Yes Min PCB Thickness 0.02
Fiducial Marks Preferred but not required
PCB Finish: 1.SMOBC/HASL
2.Electrolytic gold
3.Electroless gold
4.Electroless silver
5.Immersion gold
6.Immersion tin
7.OSP
PCB Shape Any
Panelized PCB 1.Tab routed
2.Breakaway tabs
3.V-Scored
4.Routed+ V scored
Inspection 1.X-ray analysis
2.Microscope to 20X
Rework 1.BGA removal and replacement station
2.SMT IR rework station
3.Thru-hole rework station
Min IC Pitch 0.2mm
solder paster printer 0.2mm
POP Manufacturing capability POP *3F