SMT Capacity
SMT Assembly Capacity:
High-end Manufacturing Equipment, Excellent Production Efficiency, Steamline Product Appearance.
| Item | Capability |
|---|---|
| Single and double sided SMT/PTH | Yes |
| Large parts on both sides, BGA on both sides | Yes |
| Smallest Chips size | 0201 |
| Min BGA and Micro BGA pitch and ball counts | 0.008 in. (0.2mm) pitch, ball count greater than 1000 |
| Min Leaded parts pitch | 0.008 in. (0.2 mm) |
| Max Parts size assembly by machine | 2.2 in. x 2.2 in. x 0.6 in. |
| Assembly surface mount connectors | Yes |
| Odd form parts: LED Resistor and capacitor networks Electrolytic capacitors Variable resistors and capacitors (pots) Sockets | Yes |
| Wave soldering | Yes |
| Max PCB size | 14.5 in. x 19.5 in. |
| Min PCB Thickness | 0.02 |
| Fiducial Marks | Preferred but not required |
| PCB Finish: | 1．SMOBC/HASL 2．Electrolytic gold 3．Electroless gold 4．Electroless silver 5．Immersion gold 6．Immersion tin 7．OSP |
| PCB Shape | Any |
| Panelized PCB | 1．Tab routed 2．Breakaway tabs 3．V-Scored 4．Routed+ V scored |
| Inspection | 1．X-ray analysis 2．Microscope to 20X |
| Rework | 1．BGA removal and replacement station 2．SMT IR rework station 3．Thru-hole rework station |
| Min IC Pitch | 0.2mm |
| solder paster printer | 0.2mm |
| POP Manufacturing capability | POP *3F |