SMT Capacity
SMT Assembly Capacity:
High-end Manufacturing Equipment, Excellent Production Efficiency, Steamline Product Appearance.
Item | Capability | ||
---|---|---|---|
Single and double sided SMT/PTH | Yes | ||
Large parts on both sides, BGA on both sides | Yes | ||
Smallest Chips size | 0201 | ||
Min BGA and Micro BGA pitch and ball counts | 0.008 in. (0.2mm) pitch, ball count greater than 1000 | ||
Min Leaded parts pitch | 0.008 in. (0.2 mm) | ||
Max Parts size assembly by machine | 2.2 in. x 2.2 in. x 0.6 in. | ||
Assembly surface mount connectors | Yes | ||
Odd form parts: LED Resistor and capacitor networks Electrolytic capacitors Variable resistors and capacitors (pots) Sockets | Yes | ||
Wave soldering | Yes | ||
Max PCB size | 14.5 in. x 19.5 in. | ||
Min PCB Thickness | 0.02 | Rework | 1.BGA removal and replacement station 2.SMT IR rework station 3.Thru-hole rework station |
Fiducial Marks | Preferred but not required | ||
PCB Finish: | 1.SMOBC/HASL 2.Electrolytic gold 3.Electroless gold 4.Electroless silver 5.Immersion gold 6.Immersion tin 7.OSP |
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PCB Shape | Any | ||
Panelized PCB | 1.Tab routed 2.Breakaway tabs 3.V-Scored 4.Routed+ V scored |
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Inspection | 1.X-ray analysis 2.Microscope to 20X |
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Min PCB Thickness | 0.02 | Rework | 1.BGA removal and replacement station 2.SMT IR rework station 3.Thru-hole rework station |
Min IC Pitch | 0.2mm | ||
solder paster printer | 0.2mm | ||
POP Manufacturing capability | POP *3F |