SMT Capacity
SMT Assembly Capacity:
High-end Manufacturing Equipment, Excellent Production Efficiency, Steamline Product Appearance.
| Item | Capability | ||
|---|---|---|---|
| Single and double sided SMT/PTH | Yes | ||
| Large parts on both sides, BGA on both sides | Yes | ||
| Smallest Chips size | 0201 | ||
| Min BGA and Micro BGA pitch and ball counts | 0.008 in. (0.2mm) pitch, ball count greater than 1000 | ||
| Min Leaded parts pitch | 0.008 in. (0.2 mm) | ||
| Max Parts size assembly by machine | 2.2 in. x 2.2 in. x 0.6 in. | ||
| Assembly surface mount connectors | Yes | ||
| Odd form parts: LED Resistor and capacitor networks Electrolytic capacitors Variable resistors and capacitors (pots) Sockets | Yes | ||
| Wave soldering | Yes | ||
| Max PCB size | 14.5 in. x 19.5 in. | ||
| Min PCB Thickness | 0.02 | Rework | 1．BGA removal and replacement station 2．SMT IR rework station 3．Thru-hole rework station |
| Fiducial Marks | Preferred but not required | ||
| PCB Finish: | 1．SMOBC/HASL 2．Electrolytic gold 3．Electroless gold 4．Electroless silver 5．Immersion gold 6．Immersion tin 7．OSP |
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| PCB Shape | Any | ||
| Panelized PCB | 1．Tab routed 2．Breakaway tabs 3．V-Scored 4．Routed+ V scored |
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| Inspection | 1．X-ray analysis 2．Microscope to 20X |
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| Min PCB Thickness | 0.02 | Rework | 1．BGA removal and replacement station 2．SMT IR rework station 3．Thru-hole rework station |
| Min IC Pitch | 0.2mm | ||
| solder paster printer | 0.2mm | ||
| POP Manufacturing capability | POP *3F |